
TSMC denies exploring 3D DRAM at Nvidia's request
Nvidia reportedly asks TSMC to produce '3D DRAM' to address memory shortages.
via Tom’s HardwareReported by 2 outlets
The story so far
AI summary of the reporting below · Updated · How we work
Taiwan Semiconductor Manufacturing Company has pushed back against claims that it is preparing to produce 3D DRAM memory chips at the request of Nvidia. The pushback follows reporting from The Information, which cited two people familiar with the matter stating that TSMC had begun outlining plans for 3D DRAM after Nvidia asked for the manufacturing support to alleviate memory constraints. In response, a TSMC spokesperson told Tom's Hardware that the firm focuses strictly on its core role as a dedicated logic integrated-circuit foundry and plans to remain one. [1][2]
The reported push was said to be overseen by Hsu Kuo-chin, TSMC's vice president of advanced packaging and former head of Micron's operations in Taiwan. Producing 3D DRAM, which stacks memory cells vertically rather than across a single flat plane, presents major technical hurdles. TSMC currently lacks planar DRAM production infrastructure, and the underlying technology is widely considered to be at least five years away from commercial viability for dedicated memory makers like Samsung, SK Hynix, and Micron. [2]
Separately, TSMC is continuing to deepen its involvement in memory packaging. For Nvidia's custom NVHBM, TSMC has been tapped to mass-produce base dies on its 3nm node alongside Samsung, which is shifting away from its traditional turnkey approach for core and base dies to accommodate the new hardware. [1]

Nvidia reportedly asks TSMC to produce '3D DRAM' to address memory shortages.
via Tom’s Hardware
Update - The latest word on the street is that TSMC hasn’t just been tapped to mass produce NVIDIA’s NVHBM base die, but the GPU manufacturer has reportedly requested the Taiwanese firm to begin 3D DRAM production. It didn’t take long for TSMC to comment, as it denies any plans to mass produce 3D DRAM, choosing to stick with logic chip manufacturing.
via Wccftech