Reported by 2 outlets
The story so far
AI summary of the reporting below · Updated · How we work
SK hynix is proposing to construct a 3D NAND flash memory fabrication plant in the United States, according to Reuters. In return, the South Korean chipmaker wants Washington to grant export licenses allowing American suppliers, such as Applied Materials, KLA, and Lam Research, to ship chipmaking tools to its subsidiary Solidigm's manufacturing site in Dalian, China. [2]
Solidigm plans to install the equipment in the unused space of its Dalian Mod B building, which was finished in 2023 but never completely outfitted due to a downturn in the memory market. While the U.S. Commerce Department authorized limited tool shipments to Dalian for 2026, it has not yet granted export approvals for 2027. American officials generally aim to maintain existing operations rather than support capacity expansion at semiconductor plants in China. [1][2]
The Dalian site is currently the sole production facility for 192-layer floating gate 3D NAND used in Solidigm enterprise SSDs. SK hynix contends that maximizing output in China will generate revenue needed to fund the proposed American fab, while Solidigm is also exploring an initial public offering as early as 2027 to raise additional capital. [2]
The equipment would go into unused space in Dalian's Mod B building. Completed in 2023, the building was never fully equipped because of the memory market downturn. Some tools are installed, but much of the space remains available.
via TechSpot
SK hynix reportedly conditions building new Solidigm 3D NAND fab in the U.S. to equipment exports to the Solidigm fab in Dalian, China.
via Tom’s Hardware